SEMPAC Manufacturer of Air-Cavity Plastic Packages Announces New Distributor

Logistics Insight Asia - Industry News, 18/2/2008

Sempac Inc, a Sunnyvale, California based manufacturer devoted to the design, development of "air-cavity" plastic packages used mainly during the prototype and test phase, has added TopLine to their distribution network.

TopLine, known in the industry for providing dummy components and practice PC boards will expand their product offering with Sempac's QFN, SOIC, SOP and LQFP "Open-Pak" Technology plastic packages. Sempac and TopLine share in the same philosophy for low cost solutions in their respective markets and together are offering application and design engineers expertise and technical support.

Some of the key features and benefits of Sempac Open-Pak Packages are:

· Ideal for Device Development for Telecom, Optoelectronic, RF MEMS and SensorDevices
· Bring new devices for Cell Phones, PDAs and Digital Cameras to the market quicker
· Packages meet JEDEC Outline and Footprint, are Reliable and Low Cost
· Ideal solution for Device Development and Die Qualification
· Compatible with High Volume Plastic Packages

Sempac, www.sempac.com